2 8 Fe b 20 05 Energy dependent sputtering of nano - clusters from a nanodisperse target and embedding of nanoparticles into a substrate
نویسندگان
چکیده
Au nanoparticles, prepared by thermal evaporation under high vacuum condition on Si substrate, are irradiated with Au ions at different ion energies. During ion irradiation, embedding of nanoparticles as well as ejection of nano-clusters is observed. Ejected particles (usually smaller than those on the Si substrate) due to sputtering are collected on carbon-coated transmission electron microscopy (TEM) grids. Both the TEM grids and the ion-irradiated samples are analyzed with TEM. Unirradiated as well as irradiated samples are also analyzed by Rutherford backscattering spectrometry (RBS). In the case of low energy (32 keV) ions, where the nuclear energy loss is dominant, both sputtering and embedding are less compared to medium energy (1.5 MeV). In the high energy regime (100 MeV), where the electronic energy loss is dominant, sputtering is maximum but practically there is no embedding. Ion bombardment of surfaces at an angle with respect to the surface-normal produces enhanced embedding compared to normal-incidence bombardment. The depth of embedding increases with larger angle of incidence. Au nanoparticles after ion irradiation form embedded gold-silicide. Size distribution of the sputtered Au clusters on the TEM grids for different ion energy regimes are presented.
منابع مشابه
Molecular Dynamics Simulation of Al Energetic Nano Cluster Impact (ECI) onto the Surface
On the atomic scale, Molecular Dynamic (MD) Simulation of Nano Al cluster impact on Al (100) substrate surface has been carried out for energies of 1-20 eV/atom to understand quantitatively the interaction mechanisms between the cluster atoms and the substrate atoms. The many body Embedded Atom Method (EAM) was used in this simulation. We investigated the maximum substrate temperature Tmax and...
متن کاملSimulation of Fabrication toward High Quality Thin Films for Robotic Applications by Ionized Cluster Beam Deposition
The most commonly used method for the production of thin films is based on deposition of atoms or molecules onto a solid surface. One of the suitable method is to produce high quality metallic, semiconductor and organic thin film is Ionized cluster beam deposition (ICBD), which are used in electronic, robotic, optical, optoelectronic devices. Many important factors such as cluster size, cluster...
متن کاملThe tribological properties of Cu-Ni3Al-MoS2 composite coating deposited by magnetron sputtering
In industrial applications, most materials are exposed to wear and friction because multiple conditions are used. However, the tribological properties of these materials can be improved with different techniques. One such technique that improves the frictional property of a surface is the use of self-lubricating coatings. In this study, multicomponent coatings of nominal composition Cu-Ni3Al-Mo...
متن کاملComparative Studies on the Interaction of Proteinase-K with Fe2O3, Fe3O4 and SiO2 Nanoparticles
The interaction of Fe2O3, Fe3O4 and SiO2 nanoparticles with proteinase K activity was investigated using UV–vis spectroscopy. Proteinase K EC (3.4.21.14) is a member of serine protease family, which is produced from fungus Tritirachum album Limber.The effects of nanoparticles on proteinase...
متن کاملDeposition of Al/Cu Multilayer By Double Targets Cylindrical DC Magnetron Sputtering System
A cylindrical direct current magnetron sputtering coater with two targets for deposition of multilayer thin films and cermet solar selective surfaces has been constructed. The substrate holder was able to rotate around the target for obtaining the uniform layer and separated multilayer phases. The Al/ Cu multilayer film was deposited on the glass substrate at the following conditions: Working g...
متن کامل